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  • Tech Titans Unleashed: NEO Semiconductor's 3D DRAM Revolution and Apple's Unified A18 Chipset for iPhone 16
    2024/08/12
    NEO Semiconductor introduces a groundbreaking 3D DRAM with integrated AI processing, aiming to replace current HBM technology and address data bus bottlenecks. Meanwhile, Apple's upcoming A18 chipset is expected to be featured across all iPhone 16 models, raising questions about potential specification differences between the 'Pro' and non-Pro versions.
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    7 分
  • TSMC's 2025 Price Hikes and Taiwan Stock Market Turbulence
    2024/08/08
    TSMC plans to increase pricing for its advanced 5nm and 3nm process manufacturing by 2025. Meanwhile, Taiwan's stock market experienced a swift rebound following a steep decline but quickly mitigated those initial gains.
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    7 分
  • Nvidia's AI Chip Rollout Faces Significant Delays Due to Design Flaws
    2024/08/05
    Nvidia's Next-Gen Blackwell Chip May Face Delays Due to Design Flaws

    Nvidia's upcoming AI chips, known as the Blackwell series, are reportedly facing a delay of three months or more. This setback is attributed to design flaws that need to be addressed before the chips can proceed to production.
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    6 分
  • TSMC Heads to Europe: Building Germany's First Chip Factory; ASML's Stock Rises Amid US-China Tech Tensions
    2024/08/02
    TSMC is set to begin construction on its inaugural European semiconductor manufacturing facility in Germany, marking a significant expansion. Meanwhile, ASML shares have risen amid optimism that the company will avoid repercussions in the forthcoming US-China chip conflict.
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    7 分
  • Chip Wars: Intel's Recruitment Drive and TSMC's European Expansion
    2024/08/01
    Intel is attempting to recruit senior engineers from TSMC's Arizona facility, where TSMC manufactures chips for Intel. Meanwhile, TSMC has announced plans to establish its first European fabrication plant in Dresden, Germany.
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    7 分
  • Chip Supply Chain Shake-Up: Chinese Firms Turn to Samsung, TSMC's High-NA EUV Plans Unveiled
    2024/07/31
    Chinese companies are turning to Samsung for chip orders due to concerns related to the US elections. Meanwhile, TSMC is planning to incorporate high-NA EUV tools for the production of its A14P chips starting in 2028.
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    7 分
  • TSMC Insights: 3D Chip Packaging, 2nm Facility Progress, and Moore's Law Debate
    2024/07/29
    TSMC exec emphasizes that the viability of Moore's Law is secondary to continued technology scaling, highlighting the role of 3D chip packaging in driving advancements. Despite Typhoon Gaemi, the most powerful typhoon to hit Taiwan in eight years, construction of TSMC's 2nm facility in Kaohsiung remains on schedule.
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    8 分
  • TSMC Leading the Charge: Beyond AI Hype and the Importance of IC Backend with ASEH
    2024/07/28
    TSMC's recent performance demonstrates that it is not just riding the wave of AI hype but is also significantly contributing to its development. The launch of TSMC Foundry 2.0 underscores the increasing significance of integrated circuit (IC) backend processes, as highlighted by ASEH.
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    8 分