『The Byrne-Wheeler Report』のカバーアート

The Byrne-Wheeler Report

The Byrne-Wheeler Report

著者: Joseph Byrne for Xampata Insights LLC
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Long-time semiconductor-industry analysts Joe Byrne and Bob Wheeler discuss trends and recent news. Covering microprocessors (CPUs), AI accelerators (GPUs, NPUs), and interconnect such as Ethernet, The Byrne-Wheeler Report delivers technology and business insights unavailable elsewhere.

2026 Joseph Byrne for Xampata Insights LLC
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  • AMD AI Day, Nvidia Vera, OCP APAC and Hot Chips, Plus More! | BWR 16
    2026/07/30

    In Episode 16 of the Byrne-Wheeler Report, Joe and Bob discuss the latest developments in AI hardware, including disclosures at AMD's Advancing AI day, NVIDIA Vera, and upcoming conferences Hot Chips and OCP APAC. They analyze new processor architectures, interconnect standards, and market implications for AI and data center computing.

    00:00 Introduction and episode overview

    00:24 Upcoming Conferences: Hot Chips and OCP APAC

    01:07 Intel Processor and GPU Disclosures at Hot Chips

    04:24 AMD AI Day: Helios Wide Rack and Interconnect

    06:54 AMD AI Day: EPYC Venice Gen 6 Processors

    10:37 AMD AI Day: Verano and XGMI/UALink/SUE-T Interconnect for Helios 500

    12:09 AMD AI Day: GPU Roadmap--MI 500 Scales Beyond 72 GPUs and Ratchets Up Performance

    15:31 AMD AI Day: MI455X GPU Architecture Improvements and Performance vs Nvidia Rubin

    16:44 AMD AI Day: Pensando Roadmap and Helios Scale-Out Bandwidth

    18:03 AMD AI Day: Microsoft Azure and Anthropic Customer Announcements

    20:07 Alphabet/Google Earnings and AI Infrastructure Investments

    22:37 Introduction to Astera Labs Taurus Re-Timers and Re-Drivers

    26:07 NVIDIA Vera: A High-Bandwidth CPU for GPU Hosts and App Sandboxing

    30:13 Closing Remarks and OCP-APAC, Hot Chips Reminders

    Joe: https://xpu.pub

    Bob: https://wheelersnetwork.com

    #AI hardware, #AMD, #NVIDIA, Hot Chips, #OCP APAC, processor architecture, interconnect standards, data center, AI inference, #GPU

    AMD's AI Day 2026 - https://www.amd.com/en/corporate/events/advancing-ai.html

    NVIDIA Vera Platform - https://www.nvidia.com/en-us/data-center/vera-cpu/

    Hot Chips Conference - https://www.hotchips.org

    OCP APAC Summit - https://www.opencompute.org/summit/2026-ocp-apac-summit/theme

    Astera Labs Taurus Re-timers and Re-drivers - https://www.asteralabs.com/news/astera-labs-expands-taurus-family-with-industrys-first-ocp-standard-footprint-compatible-3-2t-smart-retimers-and-smart-redrivers/

    Google Cloud Earnings Report Q2 2026 - https://abc.xyz/investor/earnings/

    Music licensed through Soundstripe.

    Code: J5RRCCF40OGJOX7B

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    31 分
  • BWR 14: Nvidia and Broadcom Earnings and News, Plus More
    2026/07/07

    Byrne and Wheeler discuss recent developments in the tech industry, including #AMD's acquisition of #MEXT, #NVIDIA's impressive growth, #Broadcom's earnings, and innovative chip technologies like #Tensordyne’s log-domain processing and #Huawei’s Tau scaling. They analyze market trends, product launches, and strategic partnerships shaping the future of semiconductors and AI hardware.

    00:00 Introduction and MEXT Acquisition

    02:16 Earnings Reports: NVIDIA's Growth and Strategy

    06:14 Broadcom's Results and Market Dynamics

    08:14 #Broadcom Tomahawk, #Marvell Teralynx, Cisco One Switches and Next-Gen Serdes

    14:17 Tensordyne

    15:46 Huawei Tau Scaling and Logic Folding

    20:18 Nvidia at GTC and with Marvell at #Computex

    24:40 #Intel and #SambaNova Announce Collaboration at Computex

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    27 分
  • BWR 15: Qualcomm Discloses ASIC Strategy, CXL Resurfaces, and Much, Much More!
    2026/07/07

    Joe and Bob discuss the latest advancements in semiconductor technology, including IBM's sub-1 nanometer process, Intel's new milestones, Qualcomm's data center strategy, Etched, OpenAI, and Oxmiq, interconnect companies/technologies such as CXL and Upscale, and memory company Micron Technology.. They explore how these innovations are shaping the future of chip design and data center infrastructure.

    00:00 Introduction and Weather Banter

    01:11 IBM's Sub-1 Nanometer Technology Announcement

    05:37 Intel's 18A-P Process Updates

    08:58 Qualcomm's Investor Day Highlights

    13:35 Modular AI Software Stack Discussion

    15:42 Qualcomm's C1000 CPU Roadmap

    19:36 Qualcomm ASIC Business Growth

    22:07 MediaTek's AI Data Center Revenue

    24:07 Emerging Startups in the XPU Space: Etched

    26:19 OpenAI/Broadcom's Jalapeno ASIC Announcement

    29:25 Upscale Secures Funding

    30:16 Micron's Earnings and Business Model

    31:58 Oxmiq Labs and GPU Innovations

    32:59 CXL Technology Resurgence: Meta and Panmnesia

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    39 分
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