『The Hardware Podcast with Fexingo: Chips, Devices, and Electronics Engineering Conversations』のカバーアート

The Hardware Podcast with Fexingo: Chips, Devices, and Electronics Engineering Conversations

The Hardware Podcast with Fexingo: Chips, Devices, and Electronics Engineering Conversations

著者： Fexingo
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Lucas and Luna sit down at a lab bench cluttered with oscilloscopes and prototype boards to talk about the engineering decisions that shape the chips powering modern life. Each episode takes one piece of hardware — a new RISC-V core, a GaN power amplifier, a MEMS accelerometer — and examines its design trade-offs, yield challenges, and market positioning. They discuss why Intel’s 20A node matters for foundry customers, how TSMC’s CoWoS packaging affects AI accelerator supply, and what the CHIPS Act subsidies mean for domestic fab construction. Lucas brings the component-level knowledge (threshold voltages, die sizes, lithography steps); Luna pushes on the system-level implications (thermal constraints, software compatibility, supply chain risk). The listener is someone who reads datasheets for fun, follows EDA tool announcements, or needs to decide between an FPGA and an ASIC for their next product. No hot takes on Apple’s latest chip — just a careful look at what the die shot reveals and whether the architecture will trickle down to mid-range devices. Can a country really onshore advanced semiconductor manufacturing in a decade? How do you test a chip with billions of transistors? And what does the shift to chiplets mean for the engineer designing a PCB today? #SemiconductorIndustry #ChipDesign #HardwareEngineering #Electronics #TSMC #Intel #RISCV #GaN #MEMS #EDA #ASIC #FPGA #CHIPSAct #DieShot #EngineeringConversations #Technology #FexingoBusiness #BusinessPodcast Keep every episode free: buymeacoffee.com/fexingo© 2026 Fexingo. All rights reserved. 経済学
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  • The Thermal Interface Material Keeping Your Chip Cool

    The Thermal Interface Material Keeping Your Chip Cool
    2026/06/05
    Every chip generates heat, but the material that moves that heat from the silicon to the heatsink rarely gets attention. In this episode, Lucas and Luna dive into thermal interface materials — the paste, pads, and liquid metals that sit between your CPU and its cooler. They break down how thermal conductivity is measured in watts per meter-kelvin, why a 1-micron air gap can kill performance, and what happens when a chip's thermal interface fails. Using the example of a 2024 consumer desktop processor that hit 95 degrees Celsius under load, they explain why TIM selection matters for both a phone's thin profile and a data center's power bill. No marketing fluff — just the physics of keeping silicon alive. #ThermalInterfaceMaterial #ChipCooling #ThermalConductivity #Semiconductor #HeatDissipation #CPU #ThermalPaste #LiquidMetal #ElectronicsEngineering #HardwareDesign #DataCenterCooling #SiliconPhysics #Technology #Engineering #FexingoBusiness #BusinessPodcast #Chips #Devices Keep every episode free: buymeacoffee.com/fexingo
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    12 分
  • The One Decision That Determines Every Chip Architecture

    The One Decision That Determines Every Chip Architecture
    2026/06/05
    Every chip design starts with a single high-stakes choice: which instruction set architecture to build on. This episode of The Hardware Podcast with Fexingo walks through why that decision shapes everything from performance to software ecosystem, with a close look at ARM's rise against x86 in data centers and how RISC-V is shaking up the landscape. Lucas and Luna break down the trade-offs between fixed ISA and custom extensions, the role of backward compatibility, and why Apple's M-series chips were a pivotal moment for ARM. They also explore the hidden costs of switching architectures and why startups are betting on RISC-V for specialized workloads. If you're curious about what gives a chip its DNA, this one's for you. #InstructionSetArchitecture #ARMvsx86 #RISCV #ChipDesign #AppleSilicon #DataCenterChips #HardwareEngineering #Technology #FexingoBusiness #BusinessPodcast #TechPodcast #Semiconductors #CPUArchitecture #SoftwareEcosystem #BackwardCompatibility #CustomExtensions #M1Chip #AmpereComputing Keep every episode free: buymeacoffee.com/fexingo
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    11 分
  • What Happens When Chip Interconnects Hit a Wall

    What Happens When Chip Interconnects Hit a Wall
    2026/06/04
    Lucas and Luna dig into the quiet crisis brewing inside every advanced chip: the interconnect bottleneck. As transistors shrink toward the atomic scale, the tiny wires that carry data between them are becoming the dominant limiter on performance and power. They break down why copper is struggling, what materials like cobalt and ruthenium might replace it, and how a shift to 'backside power delivery' is reshaping the entire chip stack. Specific numbers include the RC delay equation, resistance scaling laws, and why Intel's PowerVia technology matters. A concrete look at a problem most chip discussions skip. #ChipInterconnect #Semiconductor #CopperWiring #BacksidePowerDelivery #IntelPowerVia #Cobalt #Ruthenium #RCdelay #TSMC #Samsung #ChipDesign #Engineering #Technology #FexingoBusiness #BusinessPodcast #HardwarePodcast #ChipsDevices #ElectronicsEngineering Keep every episode free: buymeacoffee.com/fexingo
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    11 分
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