『The Hardware Podcast with Fexingo: Chips, Devices, and Electronics Engineering Conversations』のカバーアート

The Hardware Podcast with Fexingo: Chips, Devices, and Electronics Engineering Conversations

The Hardware Podcast with Fexingo: Chips, Devices, and Electronics Engineering Conversations

著者： Fexingo
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Lucas and Luna sit down at a lab bench cluttered with oscilloscopes and prototype boards to talk about the engineering decisions that shape the chips powering modern life. Each episode takes one piece of hardware — a new RISC-V core, a GaN power amplifier, a MEMS accelerometer — and examines its design trade-offs, yield challenges, and market positioning. They discuss why Intel’s 20A node matters for foundry customers, how TSMC’s CoWoS packaging affects AI accelerator supply, and what the CHIPS Act subsidies mean for domestic fab construction. Lucas brings the component-level knowledge (threshold voltages, die sizes, lithography steps); Luna pushes on the system-level implications (thermal constraints, software compatibility, supply chain risk). The listener is someone who reads datasheets for fun, follows EDA tool announcements, or needs to decide between an FPGA and an ASIC for their next product. No hot takes on Apple’s latest chip — just a careful look at what the die shot reveals and whether the architecture will trickle down to mid-range devices. Can a country really onshore advanced semiconductor manufacturing in a decade? How do you test a chip with billions of transistors? And what does the shift to chiplets mean for the engineer designing a PCB today? #SemiconductorIndustry #ChipDesign #HardwareEngineering #Electronics #TSMC #Intel #RISCV #GaN #MEMS #EDA #ASIC #FPGA #CHIPSAct #DieShot #EngineeringConversations #Technology #FexingoBusiness #BusinessPodcast Keep every episode free: buymeacoffee.com/fexingo© 2026 Fexingo. All rights reserved. 経済学
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  • How Chips Use On-Chip Rad-Hard Design for Space Electronics

    How Chips Use On-Chip Rad-Hard Design for Space Electronics
    2026/07/21
    In this episode of The Hardware Podcast, Lucas and Luna explore on-chip radiation-hardened design for space electronics. They focus on how the European Space Agency's latest microcontroller, the LEON5, uses triple modular redundancy and silicon-on-insulator technology to survive the harsh radiation environment of low-Earth orbit and deep space. They break down the specific failure mechanisms—single-event upsets and latch-ups—and how rad-hard chips differ from traditional terrestrial processors. The conversation also touches on the cost implications and whether rad-hard trickles down to critical infrastructure on Earth. If you've ever wondered how microchips survive in space, this episode delivers a concrete look at the engineering trade-offs. #SpaceElectronics #RadHard #LEON5 #ESA #TripleModularRedundancy #SiliconOnInsulator #SingleEventUpset #LatchUp #Microcontrollers #AerospaceEngineering #RadiationHardening #Technology #HardwarePodcast #FexingoBusiness #BusinessPodcast #ChipDesign #Semiconductors #SpaceTech Keep every episode free: buymeacoffee.com/fexingo
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    9 分
  • How Chips Use On-Chip Optical Interconnects for Speed

    How Chips Use On-Chip Optical Interconnects for Speed
    2026/07/21
    Lucas and Luna explore how on-chip optical interconnects are breaking the bandwidth bottleneck in data centers and AI accelerators. They focus on a specific 2025 breakthrough: a CMOS-compatible silicon photonic transceiver from a joint Ayar Labs and Intel prototype, capable of 2 Tbps per fiber. Lucas explains why electrical interconnects hit a wall around 50 pJ/bit, while optical links drop below 1 pJ/bit. Luna questions integration challenges—thermal stability, laser packaging—and Lucas walks through the hybrid laser bonding technique. They tie it to the exploding demand for memory bandwidth in large language model training, and discuss why this tech is finally ready for production, with volume sampling expected in 2027. No fluff, just concrete engineering. #OnChipOpticalInterconnects #SiliconPhotonics #AyarLabs #Intel #DataCenter #AIAccelerators #BandwidthBottleneck #CMOSCompatible #HybridLaserBonding #MemoryBandwidth #LLMTraining #2Tbps #PhotonicTransceiver #ChipletInterconnect #Technology #Engineering #FexingoBusiness #BusinessPodcast Keep every episode free: buymeacoffee.com/fexingo
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    8 分
  • How Chips Use On-Chip Microbatteries for Autonomous Sensor Power

    How Chips Use On-Chip Microbatteries for Autonomous Sensor Power
    2026/07/20
    In this episode of The Hardware Podcast, Lucas and Luna explore the emerging technology of on-chip microbatteries—tiny energy storage units integrated directly onto silicon chips. They discuss how researchers at MIT and imec are developing solid-state microbatteries with energy densities up to 100 microwatt-hours per square millimeter, enabling self-powered IoT sensors that could run for years without battery changes. The hosts examine the key challenges: thermal integration during chip fabrication, electrolyte materials that withstand semiconductor processing, and the trade-off between capacity and footprint. They also highlight a real-world application: a smart building sensor prototype that uses an on-chip microbattery to transmit temperature data every 15 minutes for over a decade. The episode concludes with a look at how this could impact medical implants, environmental monitoring, and ultra-low-power edge computing. #OnChipMicrobatteries #EnergyHarvesting #IoT #Semiconductors #SolidStateBatteries #MIT #Imec #AutonomousSensors #ChipIntegration #LowPower #MedicalImplants #EdgeComputing #BatteryTechnology #SmartBuildings #Nanotechnology #Technology #FexingoBusiness #BusinessPodcast Keep every episode free: buymeacoffee.com/fexingo
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    13 分
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