『DesignCon 2026 Kick-Off: Chiplet 3D Interconnect Designer from Keysight』のカバーアート

DesignCon 2026 Kick-Off: Chiplet 3D Interconnect Designer from Keysight

DesignCon 2026 Kick-Off: Chiplet 3D Interconnect Designer from Keysight

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In this special DesignCon 2026 Kick-Off edition, Stephen Slater of Keysight joins Judy Warner to discuss all the activities Keysight is offering on this year's conference. He highlights Keysight's NPI that will be featured at this year's show, Chiplet 3D Interconnect Designer which will be showcased in their booth. See the links below to tap into the full spectrum of technology highlights included in this year's "Superbowl of Electronics."

DesignCon Resource Hub | Keysight https://www.keysight.com/us/en/lib/events/seminars/designcon-resource-hub.html

Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs | Keysight https://www.keysight.com/us/en/about/newsroom/news-releases/2026/0217-pr-26-035-keysight-unveils-3d-interconnect-designer-for-chiplet-and-3dic-advanced-package-designs.html

Article: High-speed digital design frontier with Keysight’s Hee-Soo Lee https://semiwiki.com/eda/366688-on-the-high-speed-digital-design-frontier-with-keysights-hee-soo-lee/

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