『Beyond the Silo: Managing Data at the Speed of 3D IC Design』のカバーアート

Beyond the Silo: Managing Data at the Speed of 3D IC Design

Beyond the Silo: Managing Data at the Speed of 3D IC Design

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What happens when a single untracked design change turns into a multi-billion-dollar public scandal? What you’ll learn... (00:00) Why data — not just design — is the hidden challenge behind every 3D IC (01:55) A real-world case study: how poor traceability triggered a costly public recall (04:06) The "mini database" problem: how tool sprawl scatters chip design data (06:10) Why 3D IC makes data management so much harder than traditional SoC design (08:32) What is an "atomic change," and why it's critical for design consistency (10:15) Three foundational building blocks for managing data at scale (12:42) IPLM vs. PLM: what's the difference, and why do you need both? (15:19) The human cost of poor data management: hunting, silos, and burnout (18:15) Why better data management makes onboarding faster and easier (19:42) Inside the Perforce–Siemens partnership and what's next for 3D IC workflows More about this episode… In this episode of the Siemens 3D IC Podcast, host Tova Levy speaks with Vishal Moondhra, VP of Solutions at Perforce Software, about why data — not just design complexity — may be the biggest hidden risk in 3D IC development, and what teams can do about it. Vishal opens with a real-world cautionary tale: a major chip company that shipped a security flaw across its product line, then discovered it lacked the traceability to know which variants needed the fix — a gap that led to a multi-billion-dollar hit to its market cap. From there, the conversation digs into why 3D IC makes this problem so much worse: every tool builds its own "mini database," changes ripple across interdependent dies and interposers, and AI-driven workflows are only multiplying the volume of data being generated. Vishal introduces the concept of the "atomic change" — capturing everything or nothing, so partial updates never slip through — and lays out the foundational building blocks of scalable data management, before drawing a clear line between PLM (product-level, slow-moving, heavily governed) and IPLM (design-level, fast-paced, daily). He closes by walking through the growing partnership between Perforce and Siemens, and how IPLM is being integrated across tools like Solido, Calibre, and Questa to give engineering teams a single source of truth. Ideal for: 3D IC and SoC design teams, data and IP management leads, verification and design engineers, EDA tool users, and anyone responsible for traceability, compliance, or onboarding across a fast-scaling chip design organization. Connect with Tova Levy LinkedIn Website Connect with Vishal Moondhra LinkedIn Perforce IPLM
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