『3D IC』のカバーアート

3D IC

3D IC

著者： Siemens Digital Industries Software
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 As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing. 3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and heterogeneous computing. Join industry leaders, engineers, and innovators as we break down advanced IC packaging solutions like 2.5D/3D IC, FCBGA, FOWLP, and more. Discover how chiplets, multi-die integration, and high-bandwidth memory (HBM) are driving higher performance, lower power consumption, and scalable architectures. In each episode, we dive deep into the challenges and opportunities of IC design and manufacturing, including: Roadmap for advanced packaging and heterogeneous integration in semiconductor scaling Mainstream adoption of 3D IC—key challenges and breakthroughs Optimizing micro-architecture and integration platforms for performance and efficiency Strategic planning of chiplets and interposers for hierarchical device integration Leveraging early predictive multi-physics analysis to enhance design accuracy Automating design and routing for RDL-based fan-out wafer-level packaging (FOWLP) Exploring glass substrates for superior electrical and thermal performance Developing test-vehicles and daisy chain designs for architectural validation Ensuring reliability and manufacturability in 3D IC heterogeneous integration Mastering Signal Integrity (SI) and Power Integrity (PI) Analysis for high-speed systems Managing thermal challenges in stacked die architectures Subscribe now and stay ahead in the world of 3D IC. Learn more: Siemens 3D IC Packaging SolutionsSiemens Digital Industries Software 政治・政府
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  • Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

    Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages
    2025/08/21
    How do you design and verify a package with tens of millions of pins — without losing months to manual rework? What you’ll learn… Why chiplet-based architectures demand new approaches to IC packaging How hierarchical device planning reduces overwhelming complexity The risks of spreadsheet-based workflows and why they’re no longer viable How early, multi-domain analysis helps avoid costly late-stage redesigns What Siemens’ Innovator 3D IC Portfolio offers for synchronized, error-proof design Where you’ll find it…. (01:50) Current changes in IC Packaging and the impact on the whole ecosystem (03:00) How to manage complexity scaling (03:35) What hierarchical device planning is and why it matters (05:00) How traditional methods fall short for high-pin-count designs (06:20) The risks and consequences of package assembly errors (07:00) What next-gen tools must deliver for designers (09:10) Siemens’ Innovator 3D IC Portfolio overview More about this episode… In this episode of the Siemens 3D IC Podcast, host John McMillan speaks with Per Viklund, Director of IC Packaging and RF Product Lines at Siemens EDA, about the growing challenge of managing chiplet and interposer complexity in advanced 3D IC designs. Per explains how hierarchical device planning enables designers to work at the right level of abstraction, streamlining the creation, optimization, and verification of massive, high-pin-count packages. The discussion covers why spreadsheet-based methods no longer cut it, the risks of unsynchronized workflows, and how early, multi-domain analysis can prevent costly late-stage redesigns. The episode also introduces Siemens’ Innovator 3D IC Portfolio — a unified, AI-infused solution designed to support the entire packaging workflow, from early planning through final layout, with built-in data management to eliminate version errors. Ideal for IC packaging engineers, 3D IC architects, chiplet designers, substrate fabricators, and verification professionals working on high-complexity designs. Connect with John McMillan LinkedIn Website Connect with Per Viklund LinkedIn Website
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    10 分
  • Why SI/PI is Mission-Critical for 3D IC Success

    Why SI/PI is Mission-Critical for 3D IC Success
    2025/08/07
    How do you ensure clean, stable power and reliable signal transmission in a dense 3D IC stack without introducing late-stage surprises? What you’ll learn… What SI/PI means and why it’s essential for 3D IC reliability How 3D design shifts traditional SI/PI workflows and stakeholder roles What progressive verification looks like in practice—from architectural feasibility to detailed modeling How new standards like UCIe and AIB add flexibility—and ambiguity—to the design process The real-world challenges Siemens overcame with Chiplets, a smart substrate startup Where you’ll find it…. What is SI/PI and why does it matter in 3D IC? (1:40) How does the SI/PI flow differ from traditional monolithic designs? (3:20) What is progressive verification, and how does it help? (5:55) Who are the key stakeholders—and why is collaboration essential? (9:20) The story behind Siemens’ partnership with Chiplets (11:35) Final thoughts on the future of 3D IC and SI/PI’s role (14:05) In this episode of the Siemens 3D IC Podcast, host John McMillan sits down with John Caka, Principal SI/PI Engineer at Siemens EDA, to explore why signal and power integrity (SI/PI) analysis is more vital than ever in 3D IC workflows—and why progressive verification is key to managing complexity at every stage of design. Together, they unpack the evolving demands of SI/PI in 3D IC architecture, from early planning to vendor-specific IP verification. You'll learn how multidisciplinary teams—spanning layout, thermal, mechanical, electrical, and packaging—must align in parallel to make next-gen designs successful. This episode also shares behind-the-scenes insight into Siemens’ recent collaboration with Chiplets, highlighting the EDA tool flexibility and scalability needed for today’s massive pin-count designs. Ideal for SI/PI engineers, 3D IC architects, packaging teams, die designers, layout specialists, and system-level verification professionals. Connect with John McMillan LinkedIn Website Connect with John Caka LinkedIn Website
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    16 分
  • From Chiplets to Systems: Overcoming the Hidden Pitfalls of 3D IC Design

    From Chiplets to Systems: Overcoming the Hidden Pitfalls of 3D IC Design
    2025/07/24
    What does “multiphysics” really mean in 3D IC design—and why is it more important than ever to start early? What you’ll discover: Learn how early predictive multiphysics analysis can help prevent thermal, stress, and electrical failures later in the design cycle Understand the collaboration challenges across die, interposer, packaging, and RTL teams—and how to unify them Hear real-world insights on how system-level ownership and EDA platforms reduce risk in complex 3D IC projects Get up to speed on emerging standards like 3D Blocks and 3D PDKs that are shaping the future of chiplet integration Discover how simulation and digital twin strategies enable more accurate system-level behavior modeling In this episode of the Siemens 3D IC Podcast, host John McMillan is joined by returning guest John Ferguson, Senior Director of Product Management for Calibre 3D IC Solutions at Siemens EDA, and first-time guest Tarek Ramadhan, Application Engineering Manager for 3D IC Technical Solutions. Together, they explore why traditional SoC methodologies fall short in the 3D world, how early predictive analysis can save teams from costly late-stage surprises, and why effective collaboration across domains (and companies) is essential. From thermal and stress concerns to data format mismatches and emerging standards like 3D Blocks, this episode delivers powerful insight into future-ready 3D IC design. 👉 Ideal for IC designers, system architects, packaging engineers, RTL and ESD teams, and anyone involved in the transition from 2D to 3D IC workflows. Find what you’re looking for: How is the design process shifting from 2D and 2.5D to 3D IC (2:25) What is multi-physics, and how does it impact 3D IC design? (5:00) The hidden collaboration pitfalls between die, interposer, and packaging teams (7:30) How is it impacting collaboration between companies or within companies and between teams? (10:45) The role of new standards like 3D Blocks and 3D IC PDKs (13:10) How emerging standards like 3D Blocks and 3D IC PDKs are streamlining design workflows (14:30) Final thoughts (16:00) Connect with John McMillan LinkedIn Website Connect with Tarek Ramadan LinkedIn Website Connect with John Ferguson LinkedIn Website
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    18 分
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